Graduate Courses
Characterization Courses
Fundamentals and application of laboratory techniques to study the diversity and activity of microorganisms in environmental samples, including soil, sediment, and water. Emphasis is on culture-independent approaches, including epifluorescence microscopy, extraction and analysis of major biomolecules (DNA, RNA, protein, lipids), stable isotope probing, and metabolic rate measurements. Format will include lectures, laboratory exercises, and discussions. Students will learn how to collect, analyze, and understand common and cutting-edge datasets in environmental microbiology. Permission from instructor is required to enroll as C/NC or for 1-3 units.
Image formation and interpretation. The contrast phenomena associated with perfect and imperfect crystals from a physical point of view and from a formal treatment of electron diffraction theory. The importance of electron diffraction to systematic analysis and recent imaging developments. Recommended: 193/203, 195/205, or equivalent.
Practical techniques in transmission electron microscopy (TEM): topics include microscope operation and alignment, diffraction modes and analysis, bright-field/dark-field imaging, high resolution and aberration corrected imaging, scanning TEM (STEM) imaging, x-ray energy dispersive spectrometry (EDS) and electron energy loss spectrometry (EELS) for compositional analysis and mapping. Prerequisite: 321, consent of instructor. Enrollment limited to 12.
The science and technology of microanalytical techniques will be discussed. We consider ways to characterize the structural, compositional, morphological, electronic, optical, mechanical, and magnetic properties of surfaces and interfaces. We will talk about different types of surface analytical techniques that rely on the use of electrons, photons, ions, and sharp tips to learn about different aspects about surfaces. We also discuss strategies on how to combine such techniques to gain a more complete and quantitative picture of a surface. We will also describe the inner workings and design of the hardware involved in analyzing surfaces. *Prerequisite: some prior exposure to atomic and electronic structure of solids.
Fabrication Courses
3D bioprinting promises engineered tissues with precise structure, composition, and cellular architecture. This biofabrication technology lies at the interface of biology, bioengineering, materials science, and instrumentation. This course will teach some of the latest technologies through fundamental lectures and hands-on 3D bioprinting workshops. Student groups will embark on independent projects to innovate in any aspect or application of 3D bioprinting hardware, wetware, or software. Experience in tissue engineering (BIOE260), instrumentation (BIOE123), or biomaterials (MATSCI 381) is helpful but not required.
Polymer material design, synthesis, characterization, and application. Topics include organic and kinetic aspects of polymerization, polymer characterization techniques, and structure and properties of bulk polymers for commercial applications and emerging technologies.
For students interested in the physical bases and practical methods of silicon VLSI chip fabrication, or the impact of technology on device and circuit design, or intending to pursue doctoral research involving the use of Stanford's Nanofabrication laboratory. Process simulators illustrate concepts. Topics: principles of integrated circuit fabrication processes, physical and chemical models for crystal growth, oxidation, ion implantation, etching, deposition, lithography, and back-end processing.
Required for EE 410
Carrier generation, transport, recombination, and storage in semiconductors. Physical principles of operation of the p-n junction, heterojunction, metal semiconductor contact, bipolar junction transistor, MOS capacitor, MOS and junction field-effect transistors, and related optoelectronic devices such as CCDs, solar cells, LEDs, and detectors. First-order device models that reflect physical principles and are useful for integrated-circuit analysis and design. Prerequisite: 116 or equivalent.
This course starts by covering the device physics and technology of current silicon power semiconductor devices including power MOSFETs, IGBTs, and Thyristors. Wide bandgap materials, especially GaN and SiC are potential replacements for Si power devices because of their fundamentally better properties. This course explores what is possible in these new materials, and what the remaining challenges are for wide bandgap materials to find widespread market acceptance in power applications. Future clean, renewable energy systems and high efficiency power control systems will critically depend on the higher performance devices possible in these new materials.
Prerequisites: EE 116 or equivalent
Fundamental aspects of CVD are initially considered, first focusing on processes occurring in the gas phase and then on those occurring on the surface. Qualitative understanding is emphasized, with minimal use of equations. Adding energy both thermally and by using a plasma is discussed; atomic-layer deposition is briefly considered. Examples of CVD equipment are examined. The second portion of the tutorial examines layers deposited by CVD. The focus is on group IV semiconductors especially epitaxial and heteroepitaxial deposition, in which the crystal structure of the depositing layer is related to that of the substrate. Polycrystalline silicon and the IC interconnect system are then discussed. Finally, the use of high-density plasmas for rapid gap filling is contrasted with alternative CVD dielectric deposition processes.
Formerly EE 410. Fabrication, simulation, and testing of a submicron CMOS process. Practical aspects of IC fabrication including silicon wafer cleaning, photolithography, etching, oxidation, diffusion, ion implantation, chemical vapor deposition, physical sputtering, and electrical testing. Students also simulate the CMOS process using process simulator TSUPREM4 of the structures and electrical parameters that should result from the process flow. Taught in the nano@stanford facilities. Preference to students pursuing doctoral research program requiring SNF facilities. Enrollment limited to 20.
In modern VLSI technologies, device electrical characteristics are sensitive to structural details and therefore to fabrication techniques. How are advanced VLSI devices designed and what future changes are likely? What are the implications for device electrical performance caused by fabrication techniques? Physical models for nanometer scale structures, control of electrical characteristics (threshold voltage, short channel effects, ballistic transport) in small structures, and alternative device structures for VLSI.
Prerequisites: 216 or equivalent. Recommended: EE 212.
EE 323 examines energy in modern nanoelectronics, from fundamentals to systems. Fundamental topics include energy storage and transfer via electrons and phonons, ballistic limits of current and heat, meso- to macroscale mobility and thermal conductivity. Applied topics include power in nanoscale devices (1D nanotubes and nanowires, 2D materials, 3D silicon CMOS, resistive memory and interconnects), circuit leakage, temperature measurements, thermoelectric energy conversion, and thermal challenges in densely integrated systems.
Basic knowledge of semiconductors, transistors, and Matlab (or similar) are recommended.
Miniaturization technologies now have important roles in materials, mechanical, and biomedical engineering practice, in addition to being the foundation for information technology. This course will target an audience of first-year engineering graduate students and motivated senior-level undergraduates, with the goal of providing an introduction to M/NEMS fabrication techniques, selected device applications, and the design tradeoffs in developing systems.
The course has no specific prerequisites, other than graduate or senior standing in engineering; otherwise, students will require permission of the instructors.
This project course focuses on developing fabrication processes for ExFab, a shared facility that supports flexible lithography, heterogeneous integration, and rapid micro prototyping. Team projects are approved by the instructor and are mentored by an SNF staff member and an external mentor from industry. Students will plan and execute experiments and document them in a final presentation and report, to be made available on the lab's Wiki for the benefit of the Stanford research community.
Students must consult with Prof. Fan, SNF staff, and an external mentor, and also need to submit an approved proposal before signing up.