nano@stanford Equipment
nano@stanford is currently in the process of merging the Stanford Nanofabrication Facility (SNF) and the Stanford Nano Shared Facilities (SNSF). Some areas of the site may be incomplete or undergoing updates. We appreciate your patience and understanding.
X-ray & Surface Analysis
McCullough, Shriram, Spilker & Deep Lab
Features X-ray diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS), Nano Secondary Ion Mass Spectroscopy (NanoSIMS), and Atomic Force Microscopy (AFM).
Fabrication in Spilker
Spilker
Two 2000 square feet class 100 cleanrooms equipped with advanced electron beam lithography, scanning electron microscopy, physical vapor deposition and ion beam milling.
Equipment By Location
Map of nano@stanford Equipment Locations
nano@stanford Locations
Use the location dropdowns below to browse available instrumentation. Please visit the instrument pages linked for more detailed information including specifications, usage guidelines, and access instructions.
Visit our Ask our Technical Staff page to find contacts for more information about the equipment.
Equipment may also be found by visiting the SNF/Allen Building Equipment List, and the SNSF Facilities.
Chen IPL
All Equipment Chen IPL
Originally built as an electronics fabrication foundry, Allen supports fabrication of electronics beyond conventional silicon. The laboratory consists of a 10,500 square foot class 100 cleanroom, a Metallo- Organic Chemical Vapor Deposition (MOCVD) laboratory, and Experimental Fabrication (ExFab) lab spaces.
To access equipment in Allen & Allen Annex, you must have:
Completed Safety Training
Attended the in-person Safety Orientation
An active NEMO account
- Annealing and Oxidation
Furnaces - Deposition
e-Beam Evaporators | Sputtering Tools | Atomic Layer Deposition (ALD) | Chemical Vapor Deposition (CVD)
| Metal-Organic (MO) CVD | Plasma Enhanced (PE) CVD | Oxide Growth | Doping - Etch
Plasma Etching | Dry Resist Removal | Wet Etching | Vapor Etching - Metrology, Inspection, and Device Testing
Cleanroom Characterization Tools - Photolithography: HMDS Prime, Resist Coating, Optical Direct Write Lithography| Contact Lithography, Stepper, Resist Development, Resist Curing Ovens
- Bulk Machining
Laser Cutting | Chemical Mechanical Polishing | Wafer Saw - Wet Chemical Processing
Wet Etching Benches | Wafer Cleaning Options | Solvent Benches |Development Benches - Additional Techniques in Allen/SNF
3D Printing | Centrifugation | Fume Hoods | Controlled Environment Material Transfer | Protein Patterning | Wafer or Chip Bonding
McCullough features a wide variety of characterization equipment including a full suite of X-ray techniques, surface characterization, electron microscopy, and Raman spectroscopy
McCullough, Rooms 100-112
- Atomic Force Microscopy:
Park FX-40 | Park NX-10 - Confocal Raman Spectroscopy:
Horiba LabRAM Raman | Horiba XploRA+ Raman - Scanning Electron Microscopy:
Hitachi TM4000+ - Transmission Electron Microscopy:
FEI Tecnai G2 - Auger Spectroscopy:
PHI 700 - Photoelectron Microscopy:
Riken AC-2 Photoelectron Spectrometer - X-ray Computed Tomography:
Zeiss Xradia Versa 520 X-Ray CT - X-ray Photoelectron Spectroscopy:
PHI VersaProbe 3 | PHI VersaProbe 4 - Sample Preparation:
Fischione Ion Mill | West Bond Wire Bonder
McCullough, Room 117
- X-ray Diffraction & Scattering:
Bruker Single Crystal D8 Venture | Multiwire Laue | PANalytical Empyrean | PANalytical X'Pert 2
Recently renovated and re-equipped specimen sample preparation space supporting Electron and Focused-Ion Beam microscopes, the Moore Laboratory space focuses primarily on the preparation of TEM samples.
Please refer to this site for Sample Preparation Equipment
Moore, Room 184
- Microtoming: Leica Ultramicrotome, Leica Cryoultramicrotome
- Grinding & Polishing: Buehler Polisher, Buehler AutoMet 250, Struers Jet Polisher
- Cross Sectioning: Leica TXP, Buehler Diamond Saw, South Bay Diamond Saw
- 3D Printing: Prusa i3 MK3S+ 3D Printer, Bambu Lab P1S 3D Printer
Soft & Hybrid Materials Facility (SMF) is dedicated to fundamental research on interfaces found in systems containing polymers and low molecular weight amphiphiles. SMF provides a research facility for analysis and characterization of synthetic polymers, soft materials and polymer devices.
Shriram, Room 099
All Equipment in Soft & Hybrid Materials Facility
- Molecular Weight:
Tosoh Room-Temperature Gel Permeation Chromatography (GPC) | Tosoh High-Temperature Gel Permeation Chromatography (GPC) - Thermal Characterization:
TA Instruments Differential Scanning Calorimetry (DSC) Q2500 | TA Instruments High Temperature Thermal Gravimetric Analysis/Differential Scanning Calorimetry (TGA/DSC) - Mechanical Characterization/Rheology:
TA Instruments Rheometer | TA Instruments Dynamic Mechanical Analysis (DMA) | TA Instruments Rheometer DMA | Instron Mechanical Tester | Rheosense small volume viscometer - Particle Analysis/Pore Size/Surface Area:
Brookhaven Instrument Nanobrook Omni DLS | Anton-Paar NovaTouch Gas Sorption Analyzer | Autosorb iQ3 Gas Sorption Analyzer - Surface Energy:
Contact Angle Goniometer - Molecular Spectroscopy:
Agilent UV-Vis Spectrophotometer | Thermo Scientific FT-IR, FT-IR Microscope | Horiba Fluorolog Fluorimeter - Atomic Force Microscopy/Surface Metrology:
Bruker Dimension Icon | Bruker Dimension IconIR | Bruker Dektak Stylus Profilometer - Sample Preparation:
Oxygen Plasma Cleaner | Nikon Polarized Optical Microscope
Spilker houses two 2000 square feet class 100 cleanrooms and a cutting edge suite including scanning electron microscopy, transmission electron microscopy, ion beam microscopy and NanoSIMS.
Electron & Ion Microscopy: Spilker 007-009
- Scanning Electron Microscopy (SEM):
Thermo Apreo | FEI Magellan 400XHR - Focused Ion Beam (FIB):
Thermo Hydra Plasma FIB | FEI Helios Nanolab Dual Beam - Transmission Electron Microscopy (TEM):
Thermo Spectra Double-Corrected TEM | FEI Tecnai TEM | FEI Titan Environmental TEM NanoSIMS:
Cameca NanoSIMS 50L
Nanopatterning Cleanroom: Spilker, 006
All Equipment in the Nanopatterning Cleanroom
- E-beam Lithography:
Raith EBPG 5200+ - Scanning Electron Microscope:
Zeiss Gemini 560 - Deposition:
KJL E-beam evaporators | Cressington Tabletop Sputter Coater - Reactive Ion Etch:
Oxford PlasmaPro 80 RIE - Thin Film Characterization:
Bruker Dektak XT-S Stylus Profilometer | Filmetrics F40 | Film Sense Ellipsometer - Wet Benches:
Acid, Base, Solvent, Spinner Benches | Hot Plates, Cold Plates - Optical Inspection Microscopes:
Nikon LV100ND | Olympus Vision Engineering EVO Cam II Sample Preparation/Cleaning:
LatticeGear FlipScribe | Scribing Accessories | Samco Ozone Cleaner | Vacuum Sealer | Sonicator Bath
Flexible Cleanroom, Spilker 131
All equipment in the Flexible Cleanroom
- Lithography:
ML3 MicroWriter Direct Write - Deposition:
Oerlikon DC/RF Sputter Station | Headway Research Spinner - Etch:
Intlvac Nanoquest Ion Mill | March Instruments Plasma Asher - Thin Film Characterization:
KLA Tencor Alpha-Step - Wet Benches:
Acid, Base, Solvent, Spinner Benches - Optical Inspection Microscopes:
Nikon LV100ND | Vision Engineering EVO Cam II | Olympus BH | Olympus BH2 | Wild Stereo - Sample Processing & Preparation: VST High Vacuum Oven | Cool Cure UV Exposure Chamber | Open Cure UV Curing Tool | Vacuum Sealer | Ultrasonic Cleaner
Currently Under Construction - Instrument installations & opening planned for Spring 2026
New cutting-edge analytical facility with a strong education mission and advanced instrumentation capabilities in X-ray, surface analysis, ion beam and transmission electron microscopy. Some instrumentation will be moved to the Deep Lab in late 2025/early 2026.
- Atomic Force Microscopy
Bruker Dimension Icon | Bruker Dimension Icon-IR | Park FX-40 | Park NX-10 | Asylum Research Cypher ES - Molecular Spectroscopy
Phothothermal Optical Photothermal Infrared Microscope (OPTIR) - Raman
Horiba LabRAM | Horiba XploRA+ | WITec alpha300 Apyron - TEM
Nion UltraSTEM | Talos F200i | Talos L120C - EPMA
JEOL JXA-iHP200F field-emission EPMA (To access this instrument, see MAF) - Nanofabrication
Velion Ion Beam - X-Ray
Anton Paar SAXS | XRF